Application Cases

Experiment Name: Fluid Heat Dissipation Temperature Measurement Experiment

Research Direction:
Validation of the influence of jet height on heat dissipation performance of heat sinks, verification of the effect of vapor chamber size on heat sink performance, optimization of experimental methods, and assurance of data reliability.

Experimental Objective:
To verify the actual impact of jet height and vapor chamber size on the cooling effectiveness of piezoelectric jet heat sinks, confirming the simulation conclusion that "greater jet height and larger vapor chamber size lead to better heat dissipation performance." The experiment compares simulation and experimental data to validate the reliability of the simulation trends. Meanwhile, by using the "temperature difference" indicator and a standardized experimental platform, interference is minimized to ensure data comparability and accuracy, providing an experimental basis for structural optimization of heat sinks.

Testing Equipment:
Signal generator (UNI-T UTG2025A), power amplifier (Aigtek ATA-214), DC power supply (MAISHENG MS-3010DS), multi-channel temperature tester (UNI-T UT3216+), heating block and support base, vapor chamber.

Experimental Procedure:
A standardized experimental platform was established, consisting of a signal generator, power amplifier, piezoelectric jet pump prototype, DC power supply, multi-channel temperature tester, etc. Fixed parameters such as heating power, vapor chamber thickness, and flow channel benchmarks were determined, while key variables were selected.

For the jet height experiment, heat sinks were assembled at different heights, and equipment was calibrated. Under five operating voltages, each working condition ran stably for 10 minutes before collecting the temperature difference between the chip and room temperature. Each condition was repeated three times, and the average value was taken. The experimental results were then compared with simulation data.

For the vapor chamber size experiment, different vapor chamber sizes were used while keeping the jet height fixed. Temperature differences were collected under the same voltage conditions.

Finally, room temperature interference was eliminated using the temperature difference metric, ensuring single-run data deviation ≤3%. The deviation between experimental and simulation results was within 15%, validating the effects of jet height and vapor chamber size on heat dissipation performance.

Figure 1: Schematic Diagram of the Fluid Heat Dissipation Temperature Measurement Experiment

Figure 2: Experimental Platform Setup for Fluid Heat Dissipation Temperature Measurement

Experimental Results:

1. Jet height significantly affects heat dissipation performance. Heat sinks with jet heights of 5 mm and 8 mm exhibited significantly lower chip-to-room temperature differences compared to those with 1 mm, demonstrating superior cooling performance. The deviation between experimental and simulation temperature differences remained within 15%, consistent with simulation conclusions.

2. Vapor chamber size has a notable impact on heat dissipation. Within the studied size range, the heat sink with a 50 mm × 50 mm vapor chamber achieved a lower chip temperature than the one with 15 mm × 15 mm. The deviation between experimental and simulation temperature differences was as low as 6.7%, aligning with simulation predictions.

3. The experiment used the "chip temperature minus room temperature" difference as the core metric to eliminate ambient interference. Each working condition was measured three times, with single-run data deviation ≤3%. The consistency between experimental and simulation data further validated the reliability and accuracy of the experimental method.

   

   
   

Figure 3: Experimental Temperature Comparison of Vapor Chamber Heat Sinks

Product Recommendation: ATA-214 High-Voltage Amplifier

Figure: ATA-214 High-Voltage Amplifier Specifications and Parameters

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