Application Cases

Experiment Name: Application of Power Amplifier in Ultrasonic Elliptical Centerless Grinding Tests

Experiment Objective: To compare the grinding quality of ultrasonic elliptical centerless grinding with conventional centerless grinding, and to analyze the role of ultrasonic elliptical vibration in the material removal process based on the removal mechanism of YAG single crystal grinding.

Experimental Equipment: Elliptical vibration transducer, signal generator, ATA-2042 high-voltage amplifier.

Experimental Procedure:
Based on existing laboratory conditions, an experimental platform was built on a precision surface grinder. To accommodate the grinding of workpieces with varying diameters, an inclined slide with a groove was placed beneath the support plate. The lifting range of this slide was 10 mm, and the support plate was fixed to the inclined slide's flat surface using bolts. The overall setup is shown in the figure. The slide could move freely on the grinder table. The inclined slide and the ultrasonic elliptical vibration device were fixed using an electromagnetic chuck. The ultrasonic elliptical vibration device was driven by a signal generator with voltage amplified by the power amplifier. When the ultrasonic drive device was activated, the workpiece could rotate along its axis at the vibration coupling point.

Figure: Ultrasonic Elliptical Centerless Grinding Device

Figure: Ultrasonic Elliptical Centerless Grinding Experimental Platform

Experimental Results:
The workpiece shown in the figure was obtained using conventional centerless grinding, with a post-processing diameter of 1 mm. The grinding wheel used during processing was a cast iron-bonded diamond wheel with a grit size of W20. During orthogonal testing, a set of grinding tests without ultrasonic elliptical vibration was set up for comparison. The roughness of a) conventional centerless grinding, b) grinding without ultrasonic elliptical vibration, and c) ultrasonic elliptical centerless grinding were compared.

Experimental Conclusion:
The grinding quality of conventional centerless grinding was compared with that of grinding with and without ultrasonic elliptical vibration, verifying the role of ultrasonic elliptical vibration in the grinding process. Ultimately, YAG single crystal micro-cylinders with a surface roughness of Ra 0.56 μm and a diameter of 0.7 mm were obtained. By combining the material removal mechanism with the theory of ultrasonic elliptical vibration, the normal force acting on the workpiece by a single abrasive grain during the grinding process was established, and the reduction of normal force by ultrasonic elliptical centerless grinding was theoretically analyzed.

Figure: ATA-2042 High-Voltage Amplifier Specifications and Parameters