Application Cases

Experiment Name: Integrated Experimental Study on Piezoelectric-Driven Liquid Cooling System for Electronic Chip Heat Dissipation

Research Direction:
Aiming at the heat dissipation needs of highly integrated electronic chips, this study designs and validates a novel heat exchange system based on piezoelectric actuation. By optimizing the structural parameters of the piezoelectric micropump to enhance its driving performance and employing topology optimization methods to design efficient liquid cooling channels, the experiment demonstrates that this system exhibits superior cooling effectiveness and thermal uniformity compared to traditional heat dissipation methods, offering an innovative solution for electronic device cooling.

Experimental Objective:
Through the flow and heat transfer characteristics of coolant driven by the piezoelectric micropump in topology-optimized channels, this experiment validates the enhanced heat dissipation performance of the heat exchange system for highly integrated electronic chips. The study achieves two key goals: (1) under 6.5V and 8V thermal loads, temperature comparisons show that the topology-optimized channels reduce temperatures by 6.1°C and 11.4°C, respectively, compared to traditional straight channels; (2) at a driving voltage of 180Vpp, the flow rate and pressure output parameters (3.88 mL/min, 14.65 kPa) verify the reliability and stability of the piezoelectric micropump as the driving component.

Testing Equipment:
Signal generator, Aigtek ATA-2082 high-voltage power amplifier, pressure sensor, electronic balance, thermal imaging camera, 5W heating ceramic plate, DC power supply, temperature analysis software, UV curing equipment, micro-flow metering system.

Experimental Procedure:
First, PI film cantilever valve plates of different thicknesses were fabricated, and a piezoelectric micropump was assembled by combining a copper pump body with an upper cover plate. The micropump was driven by a signal generator and a power amplifier, and its output performance was measured using an electronic balance and a pressure sensor. The optimal parameters were determined: valve plate thickness of 0.025 mm, inlet/outlet diameter of 1.0 mm, and chamber height of 0.03 mm, achieving a maximum flow rate of 4.1 mL/min and a maximum pressure of 18.2 kPa. Subsequently, a heat dissipation experimental platform was established, using a heating ceramic plate to simulate the chip heat source. The heat dissipation performance of three modes—natural cooling, straight-channel liquid cooling, and topology-optimized channel liquid cooling—was compared and tested.

Figure 1: Flow Rate Test Schematic

Figure 2: Pressure Test Schematic

Experimental Results:
The experiment on the piezoelectric micropump-driven heat exchange system demonstrates that topology-optimized channels significantly outperform traditional structures in heat dissipation performance. Under a 6.5V heat source input, the topology-optimized channel achieved the lowest temperature (43.2°C), which was 35.7°C lower than natural cooling and 6.1°C lower than the straight channel. Under an 8V input, the topology-optimized channel temperature (56.3°C) was 42.5°C lower than natural cooling and 11.4°C lower than the straight channel. With optimized parameters (valve plate thickness of 0.025 mm, inlet/outlet diameter of 1.0 mm, chamber height of 0.03 mm), the piezoelectric micropump achieved its best output performance (flow rate of 3.88 mL/min, pressure of 14.65 kPa), with a maximum output pressure of 18.2 kPa (at 200Vpp driving voltage). The experiment validates the efficient heat dissipation capability of topology-optimized channels in piezoelectric-driven heat exchange systems, providing a reliable solution for electronic chip cooling.

Figure 3: Temperature vs. Time Curves for Different Heat Dissipation Methods

Figure 4: Temperature vs. Time Curves for Different Heat Dissipation Methods

Figure 5: Temperature vs. Time Curves of the Heat Exchange System Under Different Driving Voltages

Recommended Voltage Amplifier: ATA-2082

Figure: ATA-2082 High-Voltage Amplifier Specifications

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